Testing cybersecurity defenses in additive manufacturing and computer aided design

The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.


Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.

Purple - Blue Gradient

2021 winners

Congratulations to our winning teams! 
Global Prize Mark (2).png

fall challenge

Registration Deadline | 1 November 2021

Qualification Round | 3 - 5 November 2021

Finalist Notification | 6 November 2021

Final Round | 8 - 10 November 2021

Final Presentations | 12 November 2021

Please see Rules & Guidelines for the full details of the competition calendar. 


Purple - Blue Gradient
Congratulations to our Summer & Fall Finalists!
Global Prize Mark (2).png

summer challenge

CSAW summer games are here! The Hack3D Summer Challenge provides an opportunity for students to test the security limits in additive manufacturing and to decode the security features in computed aided designs. Participation in the summer is not a requirement for the fall CSAW competition, but it's a great way to get involved and stay engaged. Plus, the top 3 teams from the Summer Challenge will get direct entry to the final round of the CSAW'21 Hack3D competition in November 2021 and cash prizes! 

Preliminary Round

26 - 30 July 2021

Cash Prizes

1st Place: US $500

2nd Place: US $300

3rd Place: US $200

Final Round

2 - 3 August 2021

Congratulations to our Summer Challenge Winners & Finalist Teams! 
Hack3D Summer Challenge Winners.png
Hack3D Summer Challenge Finalists.png



 research & publications

Hack3D paper

Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing

May 2020


2020 challenge

2020 Introduction to the Competition
Jigsaw puzzle.jpg
2020 warm-up challenges
2020 Finalist Presentations
Hack3D Registration Challenge.jpg
2020 warm-up challenges


The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering. 

Email the Leads

Thank you to the National Science Foundation for their generous support of this competition