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Testing cybersecurity defenses in additive manufacturing and computer aided design

The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.


Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.

Fall Challenge

fall challenge

Registration Deadline | 6 October 2023

Qualification Round |  7 - 8 October 2023

Finalist Notification | 10 October 2023

Final Round | 9 November 2023

Final Presentations | 8 November 2024

Please see Rules & Guidelines for the full details of the competition calendar. 


Abhijit Chakraborty

Yan Lu

Chrys Koomson

Vikas Varshney

 research & publications


Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing

May 2020

Purple - Blue Gradient

2023 winners

Congratulations to our winning teams! 
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2022 winners

Global Winners
Global Finalists
Purple - Blue Gradient
Congratulations to our winning teams! 
Global Prize Mark (2).png
Congratulations to our Finalists!
Global Prize Mark (2).png

2021 challenge

2021 Introduction to the Competition
2021 Finalist Presentations

2020 challenge

2020 Introduction to the Competition
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2020 warm-up challenges
2020 Finalist Presentations
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2020 warm-up challenges
2021 Competition
2020 Competition


The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering. 

Email the Leads

Thank you to the National Science Foundation for their generous support of this competition

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