© 2020 by NYU Tandon School of Engineering CSAW 

The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field. In Hack3D’s 2019 Qualifying Round, participants were challenged to reconstruct a corrupted .gcode file, employing skills in graphics programming, file manipulation, and reverse-engineering. In the Final Round, teams will compete in hacking an anti-counterfeiting system designed to protect CAD models.

hack3d

competition

competition timeline

Competition Details & Registration Opens:

TBD Summer 2020

Submission Deadline:

TBD September 2020

Finalist Notification:

by 7 October 2020 

Final On-Site Competition:

5 - 7 November 2020

participating regions

rules & submission guidelines

Pending 
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competition organizers & judges

The Hack3D competition is organized by Professor Nikhil Gupta and student researchers in the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering.  

Email the Leads

2019 winners & finalists 

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Thank you to the National Science Foundation for their generous support of this competition

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