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Testing cybersecurity defenses in additive manufacturing and computer aided design

The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.

 

Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.

 

fall challenge

Registration Deadline | 26 September 2022

Qualification Round | 26 - 27 September 2022

Finalist Notification | 29 September 2022

Final Round | 10 November 2022

Final Presentations | 11 November 2022

Please see Rules & Guidelines for the full details of the competition calendar. 

judges

 

summer challenge

CSAW summer games are here! The Hack3D Summer Challenge provides an opportunity for students to test the security limits in additive manufacturing and to decode the security features in computed aided designs. Participation in the summer is not a requirement for the fall CSAW competition, but it's a great way to get involved and stay engaged. Plus, the top 3 teams from the Summer Challenge will get direct entry to the final round of the CSAW'22 Hack3D competition in November 2022 and cash prizes! 

Preliminary Round

5 - 7 July 2022

Hack3D Final Presentation

15 July 2022

10:30 AM - 12 PM ET

Final Round

14 - 15 July 2022

Cash Prizes

1st Place: US $750

2nd Place: US $500

3rd Place: US $250

judges

 
 

 research & publications

Hack3D paper

Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing

May 2020

 
 
Congratulations to our Summer Challenge Winners & Finalist Teams! 
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Purple - Blue Gradient

2021 winners

Congratulations to our winning teams! 
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Purple - Blue Gradient
Congratulations to our Summer & Fall Finalists!
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2021 challenge

2021 Introduction to the Competition
2021 Finalist Presentations

2020 challenge

2020 Introduction to the Competition
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2020 warm-up challenges
2020 Finalist Presentations
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2020 warm-up challenges
 
 
 

organizers

The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering. 

Email the Leads

Thank you to the National Science Foundation for their generous support of this competition

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