The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing (AM) field.
In Hack3D’s 2019 Qualifying Round, participants are challenged to reconstruct a corrupted .gcode file, employing skills in file forensics and reverse-engineering.
In the Final Round, teams will compete in hacking an anti-counterfeiting system designed to protect CAD models.
Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to apply.
Hack3D is generously supported by the National Science Foundation.
Participation Regions
- CSAW US-Canada - hosted by NYU Tandon School of Engineering
TIMELINE
5 June 2019: Registration Opens. Qualification Round instructions are distributed to registered teams on a rolling basis (approximately once a week, beginning on 10 June)
1 August 2019: Qualification Round details released
20 September 2019: Registration deadline
29 September 2019 : Qualification Round submission deadline
No later than 7 October 2019: Finalist notification
7 - 8 November 2019: in-person Final competition
Register Now
Team registration for the 2019 Hack3D competition
Competition Files
Challenge instructions, gcode files, and other details
Student Leads + Faculty Advisors
Competition eligibility + registration link
Final round experts for Hack3D
Awards given for 1st, 2nd, and 3rd place
See the finalists of the Hack3D competition.
The Hack3D winners of CSAW'18.