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hack3d
competition
The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field. In Hack3D’s 2019 Qualifying Round, participants were challenged to reconstruct a corrupted .gcode file, employing skills in graphics programming, file manipulation, and reverse-engineering. In the Final Round, teams competed in hacking an anti-counterfeiting system designed to protect CAD models.
competition timeline
Competition Details & Registration Opens
10 August 2020
Qualification Round Start Date
15 September 2020
Competition Introductory Webinars
29 September, 9-9:30 AM ET
https://nyu.zoom.us/s/94165009697
8 October, 9-9:30 AM ET https://nyu.zoom.us/s/96220491157
Qualification Round Submission Deadline
16 October 2020
Finalist Notification
21 October 2020
Final Round Start
2 November 2020
Virtual Final Conference & Competition*:
5 - 7 November 2020
*Final presentations tentatively scheduled for 6 November
Award Ceremony:
8 November 2020
participating regions
2020 warm-up challenges
Can you solve these 3D jigsaw basketball and color CAD model puzzles?
Email a screenshot of your results and any feedback to csaw-3d@nyu.edu.
rules & registration
introduction to the competition
Join us at these quick, 30-minute webinars to meet the organizers and past participants, and to learn more about this competition.
29 September, 9-9:30 AM ET
8 October, 9-9:30 AM ET
competition organizers & judges
The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and student researchers in the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering.
Email the Leads
