17th Annual
17th Annual
17th Annual
Testing cybersecurity defenses in additive manufacturing and computer aided design
The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.
Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.
fall challenge
Registration Deadline | 26 September 2022
Qualification Round | 26 - 27 September 2022
Finalist Notification | 29 September 2022
Final Round | 10 November 2022
Final Presentations | 11 November 2022
Please see Rules & Guidelines for the full details of the competition calendar.
judges
summer challenge
CSAW summer games are here! The Hack3D Summer Challenge provides an opportunity for students to test the security limits in additive manufacturing and to decode the security features in computed aided designs. Participation in the summer is not a requirement for the fall CSAW competition, but it's a great way to get involved and stay engaged. Plus, the top 3 teams from the Summer Challenge will get direct entry to the final round of the CSAW'22 Hack3D competition in November 2022 and cash prizes!
Preliminary Round
5 - 7 July 2022
Hack3D Final Presentation
15 July 2022
10:30 AM - 12 PM ET
Final Round
14 - 15 July 2022
Cash Prizes
1st Place: US $750
2nd Place: US $500
3rd Place: US $250
judges
research & publications
Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing
May 2020
Congratulations to our Summer Challenge Winners & Finalist Teams!
Congratulations to our Summer & Fall Finalists!
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2021 challenge
2021 Introduction to the Competition
2021 Finalist Presentations
2020 challenge
2020 Introduction to the Competition
2020 warm-up challenges
2020 Finalist Presentations
2020 warm-up challenges
organizers
The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering.
Email the Leads
Thank you to the National Science Foundation for their generous support of this competition
