hack3d

competition

The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field. In Hack3D’s 2019 Qualifying Round, participants were challenged to reconstruct a corrupted .gcode file, employing skills in graphics programming, file manipulation, and reverse-engineering. In the Final Round, teams competed in hacking an anti-counterfeiting system designed to protect CAD models.

competition timeline

Competition Details & Registration Opens

10 August 2020

Qualification Round Start Date

15 September 2020

Competition Introductory Webinars

29 September, 9-9:30 AM ET

https://nyu.zoom.us/s/94165009697

 

8 October, 9-9:30 AM ET https://nyu.zoom.us/s/96220491157

Qualification Round Submission Deadline

16 October 2020

Finalist Notification

21 October 2020 

Final Round Start 

2 November 2020 

Virtual Final Conference & Competition*:

5 - 7 November 2020

*Final presentations tentatively scheduled for 6 November 

Award Ceremony:

8 November 2020 

participating regions

1/6
Hack3D paper

2020 warm-up challenges

Can you solve these 3D jigsaw basketball and color CAD model puzzles?

 

Email a screenshot of your results and any feedback to csaw-3d@nyu.edu. 

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rules & registration

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introduction to the competition

Join us at these quick, 30-minute webinars to meet the organizers and past participants, and to learn more about this competition. 

29 September, 9-9:30 AM ET

8 October, 9-9:30 AM ET

https://nyu.zoom.us/s/96220491157

competition organizers & judges

The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and student researchers in the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering. 

Email the Leads

2020  finalists 

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Thank you to the National Science Foundation for their generous support of this competition

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© 2020 by NYU Tandon School of Engineering CSAW