The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.

Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.

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summer challenge

CSAW summer games are here! The Hack3D Summer Challenge provides an opportunity for students to test the security limits in additive manufacturing and to decode the security features in computed aided designs. Participation in the summer is not a requirement for the fall CSAW competition, but it's a great way to get involved and stay engaged. Plus, the top 3 teams from the Summer Challenge will get direct entry to the final round of the CSAW'21 Hack3D competition in November 2021.

fall challenge

Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing

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May 2020

2020 challenge

2020 Introduction to the Competition

2020 warm-up challenges

2020 Finalist Presentations

2020 warm-up challenges

Congratulations to our 2020 Finalists & Winners

organizers

The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering. 

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Thank you to the National Science Foundation for their generous support of this competition