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hack3d
competition
The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.
Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.
summer challenge
CSAW summer games are here! The Hack3D Summer Challenge provides an opportunity for students to test the security limits in additive manufacturing and to decode the security features in computed aided designs. Participation in the summer is not a requirement for the fall CSAW competition, but it's a great way to get involved and stay engaged. Plus, the top 3 teams from the Summer Challenge will get direct entry to the final round of the CSAW'21 Hack3D competition in November 2021.
Preliminary Round
26 - 30 July 2021
Final Round
2 - 3 August 2021
fall challenge
Qualification Round
TBA 2021
Final Round Start
TBA November 2021
Finalist Notification
15 October 2021
Final Conference & Team Presentations
10 - 14 November 2021*
*Final presentations to be scheduled with finalist teams in advance
Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing
May 2020
2020 challenge
2020 Introduction to the Competition
2020 warm-up challenges
2020 Finalist Presentations
2020 warm-up challenges
Congratulations
to our 2020 Finalists & Winners
organizers
The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering.
Email the Leads
Thank you to the National Science Foundation for their generous support of this competition
