CSAW US-Canada-NYU Tandon School of Engineering
Nishant Aswani, Challenge Co-lead
Nishant grew up in Shenzhen, China for 17 years where he completed high school. He is currently a junior working towards his B.Sc. Computer Engineering degree at New York University Abu Dhabi (NYUAD). He has worked in Professor Nikhil Gupta’s lab as part of the NYU Summer Research Program, focusing on efficient methods to decode a digitally encrypted 3D model. Nishant’s interests include security, home automation, and graphics programming.
Michael Linares, Challenge Co-lead
Michael Linares is currently a Junior in Mechanical Engineering at NYU Tandon School of Engineering. Since 2018, Michael has worked in Professor Nikhil Gupta’s lab as an assistant to Fei Chen and as a researcher in the NYU Summer Research Program. His research focuses on security through geometric obfuscation within additive manufacturing. Michael’s intreests include product authentication, material science, and robotics.
Gary Mac, Challenge Co-lead
I received my BS/MS in ME in 2016 from NYU Tandon and I have been working for TriMech since 2014. TriMech is a reseller company for SolidWorks, Stratasys, and many other engineering softwares. I worked as an application engineer in TriMech and I mainly support our customers in SolidWorks and SolidWorks’ other products. I have recently been accepted into the PhD program for Fall 2019 and I work directly with Prof. Gupta. My research involves utilizing my expertise in SolidWorks CAD to develop security features for additive manufacturing. I will be conducting different studies to find out how the files that are essential to additive manufacturing can be protected when it is being translated and shared.
Nikhil Gupta, Faculty Lead
Nikhil Gupta is a Professor in the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering. He is also affiliated with Center for Cybersecurity and the Department of Civil and Urban Engineering.
His current research projects are focused on cybersecurity in 3D printing and use of machine learning methods in materials science research. His group has pioneered design based security methods and product authentication and anti-reverse engineering technologies for 3D printing field. In addition, his group is working on developing new filaments of advanced composite materials for enabling deployment grade 3D printed components.