17th Annual
17th Annual
17th Annual
Testing cybersecurity defenses in additive manufacturing and computer aided design
The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing field.
Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain. Students who are interested in learning more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to participate.
JUDGES
Abhijit Chakraborty
Yan Lu
Chrys Koomson
Vikas Varshney
research & publications
Hack3D: Evaluating Cybersecurity Additive Manufacturing by Crowdsourcing
May 2020
Congratulations to our Summer Challenge Winners & Finalist Teams!
2023 winners
Congratulations to our winning teams!
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2022 winners
organizers
The Hack3D competition is organized by Professor Nikhil Gupta, post-doctoral researcher Hammond Pearce, and PhD student Gary Mac, from the Department of Mechanical and Aerospace Engineering at NYU Tandon School of Engineering.
Email the Leads
Thank you to the National Science Foundation for their generous support of this competition
